As previously noted in our updates, the yield problems are now coming to a head and affecting the upstream material supply chain.
Major PCB manufacturers have reportedly experienced delamination/warpage issues (colloquially termed 'exploding boards') during the production of CCL that utilize HVLP3/4 copper foil from Mitsui Mining. This quality concern has led to a reduction in Mitsui's supply allocation. Conversely, CO-TECH has seen its supply share increase.
Regarding China's Anhui Tongguan Copper Foil , we confirm that they were never on the official approved supplier list from the outset. Their claims of supplying the market appear to be solely based on the provision of samples for qualification purposes.
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Major PCB manufacturers have reportedly experienced delamination/warpage issues (colloquially termed 'exploding boards') during the production of CCL that utilize HVLP3/4 copper foil from Mitsui Mining. This quality concern has led to a reduction in Mitsui's supply allocation. Conversely, CO-TECH has seen its supply share increase.
Regarding China's Anhui Tongguan Copper Foil , we confirm that they were never on the official approved supplier list from the outset. Their claims of supplying the market appear to be solely based on the provision of samples for qualification purposes.
substack.com
