9月18日,华为轮值董事长徐直军在华为全联接大会上首次公布了昇腾芯片演进和目标。他表示,未来三年,华为已经规划了昇腾多款芯片,包括950PR,950DT以及昇腾960和970。其中950PR2026年第一季度对外推出,该芯片采取了华为自研HBM。
来源:第一财经
To state it plainly: We never reduce model quality due to demand, time of day, or server load. The problems our users reported were due to infrastructure bugs alone.